TDK Expands Compact 500V Snap-In Capacitors for AI Servers
The expanded series offers capacitance up to 2060µF, ripple currents up to 5.39A and a service life of 5,000 hours at 105°C.
Understanding the Quickly Evolving AI Data Center Architecture (Podcast)
The expanded series offers capacitance up to 2060µF, ripple currents up to 5.39A and a service life of 5,000 hours at 105°C.
The configurable platform supports 28V, 50V and 270V buses, with outputs from 1W to 5kW and operation from −55°C to +110°C.
Here’s a RoundUp of this week’s must-read articles – we’ll delve into the latest developments on Electrification and AI Data Centers, Power Conversion in the Hydrogen Economy, and PCS Architectures for Utility-Scale BESSes!
The new devices combine low RDS(ON), high drain current and wettable flanks for compact, high-density automotive power designs.
The new 20A module integrates IGBTs, drivers and protection in an 18.8mm × 32.8mm DBC package for compact inverter designs.
The new IC consumes less than 0.75mW at 230VAC and supports AC-DC designs with X-capacitance from 100nF to 6μF.
The new rectifiers improve thermal performance and surge capability while supporting automated optical inspection in compact PCB designs.
The system combines 12 A/µs current dynamics, 95% energy recovery and scalable power to 1,920 kW for advanced power-system validation.
The TPF12500 combines wide-range 3-phase input, 97.5% efficiency and parallel operation for high-power industrial and data-center systems.
The XFD11KxxCA series combines 11kW pulse capability, low leakage and near-unity clamping ratio for automotive and industrial protection.