https://impedancecalculator.com/_next/static/chunks/4960-52620b3e2…?dpl=dpl_5qRmgurCpyQ7sVGgLJVtHdY7LmL7

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Dies bietet einen niedriginduktiven R\xfcckpfad f\xfcr Hochgeschwindigkeitssignale.":j?"各信号層には隣接するGNDまたはPWRプレーンが必要です。これにより高速信号に低インダクタンスのリターンパスが提供されます。":v?"Cada capa de se\xf1al debe tener un plano GND o PWR adyacente. Esto proporciona una ruta de retorno de baja inductancia para se\xf1ales de alta velocidad.":y?"Cada camada de sinal deve ter um plano GND ou PWR adjacente. Isso fornece um caminho de retorno de baixa indut\xe2ncia para sinais de alta velocidade.":S?"Ogni strato di 

1segnale dovrebbe avere un piano GND o PWR adiacente. Ci\xf2 fornisce un percorso di ritorno a bassa induttanza per segnali ad alta velocit\xe0.":k?"각 신호 레이어는 인접한 GND 또는 PWR 평면이 있어야 합니다. 이것은 고속 신호에 대한 낮은 인덕턴스 리턴 경로를 제공합니다.":D?"Каждый сигнальный слой должен иметь смежную плоскость GND или PWR. Это обеспечивает низкоиндуктивный обратный путь для высокоскоростных сигналов.":"Every signal layer should have an adjacent GND or PWR plane. This provides a low-inductance return path for high-speed signals."})]}),(0,i.jsxs)("div",{className:"bg-white/10 rounded-lg p-4 backdrop-blur-sm",children:[(0,i.jsx)("div",{className:"text-amber-300 font-bold mb-2",children:s?"GND vs PWR 参考":n?"R\xe9f\xe9rence GND vs PWR":r?"GND vs PWR Referenz":j?"GND vs PWR リファレンス":v?"Referencia GND vs PWR":y?"Refer\xeancia GND vs PWR":S?"Riferimento GND vs PWR":k?"GND vs PWR 기준":D?"Опорная GND vs PWR":"GND vs PWR Reference"}),(0,i.jsx)("p",{className:"text-sm text-indigo-100",children:s?"优先使用 GND 平面作为高速信号的参考。电源平面由于开关电流会有更高的噪声。":n?"Pr\xe9f\xe9rez les plans GND comme r\xe9f\xe9rence pour les signaux haute vitesse. Les plans d'alimentation ont plus de bruit en raison des courants de commutation.":r?"Bevorzugen Sie GND-Ebenen als Referenz f\xfcr Hochgeschwindigkeitssignale. Versorgungsebenen haben aufgrund von Schaltstr\xf6men mehr Rauschen.":j?"高速信号のリファレンスにはGNDプレーンを優先してください。電源プレーンはスイッチング電流によりノイズが高くなります。":v?"Prefiera planos GND como referencia para se\xf1ales de alta velocidad. Los planos de alimentaci\xf3n tienen m\xe1s ruido debido a las corrientes de conmutaci\xf3n.":y?"Prefira planos GND como refer\xeancia para sinais de alta velocidade. Planos de alimenta\xe7\xe3o t\xeam mais ru\xeddo devido a correntes de comuta\xe7\xe3o.":S?"Preferire piani GND come riferimento per segnali ad alta velocit\xe0. I piani di alimentazione hanno pi\xf9 rumore a causa delle correnti di commutazione.":k?"고속 신호의 기준으로 GND 평면을 선호하십시오. 전원 평면은 스위칭 전류로 인해 더 높은 노이즈를 가집니다.":D?"Предпочитайте плоскости GND в качестве опорных для высокоскоростных сигналов. Плоскости питания имеют больше шума из-за коммутационных токов.":"Prefer GND planes as reference for high-speed signals. Power planes have higher noise due to switching currents."})]}),(0,i.jsxs)("div",{className:"bg-white/10 rounded-lg p-4 backdrop-blur-sm",children:[(0,i.jsx)("div",{className:"text-amber-300 font-bold mb-2",children:s?"减少层间转换":n?"Minimiser les transitions de couches":r?"Lagen\xfcberg\xe4nge minimieren":j?"層間遷移を最小化":v?"Minimizar transiciones de capa":y?"Minim

1izar transi\xe7\xf5es de camada":S?"Minimizzare transizioni di strato":k?"레이어 전환 최소화":D?"Минимизировать переходы слоев":"Minimize Layer Transitions"}),(0,i.jsx)("p",{className:"text-sm text-indigo-100",children:s?"每个过孔都会增加电感并导致阻抗不连续。尽可能在单层布线关键信号。":n?"Chaque via ajoute de l'inductance et provoque une discontinuit\xe9 d'imp\xe9dance. Routez les signaux critiques sur une seule couche si possible.":r?"Jedes Via f\xfcgt Induktivit\xe4t hinzu und verursacht Impedanzdiskontinuit\xe4t. F\xfchren Sie kritische Signale wenn m\xf6glich auf einer einzigen Lage.":j?"各ビアはインダクタンスを追加し、インピーダンス不連続を引き起こします。可能な限り重要な信号は単層で配線してください。":v?"Cada v\xeda a\xf1ade inductancia y causa discontinuidad de impedancia. Enrute se\xf1ales cr\xedticas en una sola capa cuando sea posible.":y?"Cada via adiciona indut\xe2ncia e causa descontinuidade de imped\xe2ncia. Roteie sinais cr\xedticos em uma \xfanica camada quando poss\xedvel.":S?"Ogni via aggiunge induttanza e causa discontinuit\xe0 di impedenza. Instrada segnali critici su un singolo strato quando possibile.":k?"각 비아는 인덕턴스를 추가하고 임피던스 불연속을 일으킵니다. 가능한 경우 중요한 신호를 단일 레이어에 배선하십시오.":D?"Каждый переход добавляет индуктивность и вызывает разрыв импеданса. Трассируйте критические сигналы на одном слое, когда это возможно.":"Each via adds inductance and causes impedance discontinuity. Route critical signals on a single layer when possible."})]}),(0,i.jsxs)("div",{className:"bg-white/10 rounded-lg p-4 backdrop-blur-sm",children:[(0,i.jsx)("div",{className:"text-amber-300 font-bold mb-2",children:s?"考虑蚀刻补偿":n?"Consid\xe9rer la compensation de gravure":r?"\xc4tzausgleich ber\xfccksichtigen":j?"エッチング補正を考慮":v?"Considerar compensaci\xf3n de grabado":y?"Considerar compensa\xe7\xe3o de corros\xe3o":S?"Considerare compensazione di incisione":k?"에칭 보정 고려":D?"Учитывать компенсацию травления":"Consider Etch Compensation"}),(0,i.jsx)("p",{className:"text-sm text-indigo-100",children:s?"内层与外层的蚀刻方式不同。与您的 PCB 厂商合作了解其蚀刻因子，以获得准确的阻抗。":n?"Les couches internes et externes sont grav\xe9es diff\xe9remment. Travaillez avec votre fabricant pour comprendre leurs facteurs de gravure pour une imp\xe9dance pr\xe9cise.":r?"Innere und \xe4u\xdfere Lagen werden unterschiedlich ge\xe4tzt. Arbeiten Sie mit Ihrem Fertiger zusammen, um deren \xc4tzfaktoren f\xfcr genaue Impedanz zu verstehen.":j?"内層と外層では異なるエッチングが行われます。正確なインピーダンスのため、製造業者と協力してエッチングファクターを理解してください。":v?"Las capas internas y externas se graban de manera diferente. Trabaje con su fabricante para entender sus factores de grabado para impedancia precisa.":y?"Camadas internas e externas s\xe3o corro\xeddas de forma diferente. Trabalhe com seu fabricante para entender seus fatores de corros\xe3o para imped\xe2ncia precisa.":S?"Gli strati interni ed esterni vengono incisi in modo diverso. Lavora con il tuo produttore per comprendere i loro fattori di incisione per un'impedenza precisa.":k?"내부 레이어와 외부 레이어는 다르게 에칭됩니다. 정확한 임피던스를 위해 제조업체와 협력하여 에칭 요소를 이해하십시오.":D?"Внутренние и внешние слои травятся по-разному. Работайте с вашим производителем, чтобы понять их факторы травления для точного импеданса.":"Inner layers etch differently than outer layers. Work with your fab to understand their etch factors for accurate impedance."})]}),(0,i.jsxs)("div",{className:"bg-white/10 rounded-lg p-4 backdrop-blur-sm",children:[(0,i.jsx)("div",{className:"text-amber-300 font-bold mb-2",children:s?"玻璃纤维效应":n?"Effet de tissage de verre":r?"Glasgewebe-Effekt":j?"ガラス織り効果":v?"Efecto de tejido de vidrio":y?"Efeito de trama de vidro":S?"Effetto di tessitura del vetro":k?"유리 직조 효과":D?"Эффект стеклоткани":"Glass Weave Effect"}),(0,i.jsx)("p",{className:"text-sm text-indigo-100",children:s?"在高速场景（10G+）下，Dk 会随走线方向与玻璃纤维的角度而变化。使用分散玻璃布或将走线旋转 7-15\xb0。":n?"\xc0 haute vitesse (10G

1+), Dk varie avec l'orientation des traces par rapport au tissage de verre. Utilisez du verre \xe9tal\xe9 ou tournez les traces de 7-15\xb0.":r?"Bei hohen Geschwindigkeiten (10G+) variiert Dk mit der Leiterbahnausrichtung zum Glasgewebe. Verwenden Sie Spread Glass oder drehen Sie Leiterbahnen um 7-15\xb0.":j?"高速（10G+）では、Dkはトレースの向きとガラス織りに対して変化します。スプレッドガラスを使用するか、トレースを7-15\xb0回転させてください。":v?"A alta velocidad (10G+), Dk var\xeda con la orientaci\xf3n de las pistas respecto al tejido de vidrio. Use vidrio disperso o rote las pistas 7-15\xb0.":y?"Em alta velocidade (10G+), Dk varia com a orienta\xe7\xe3o das trilhas em rela\xe7\xe3o \xe0 trama de vidro. Use vidro disperso ou rotacione as trilhas 7-15\xb0.":S?"Ad alta velocit\xe0 (10G+), Dk varia con l'orientamento delle tracce rispetto alla tessitura del vetro. Usa vetro disperso o ruota le tracce di 7-15\xb0.":k?"고속(10G+)에서는 Dk가 유리 직조에 대한 트레이스 방향에 따라 달라집니다. 분산 유리를 사용하거나 트레이스를 7-15\xb0 회전하십시오.":D?"На высоких скоростях (10G+) Dk изменяется в зависимости от ориентации трасс относительно стеклоткани. Используйте рассеянное стекло или поверните трассы на 7-15\xb0.":"At high speeds (10G+), Dk varies with trace orientation vs glass weave. 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Pour les conceptions de production, v\xe9rifiez avec une simulation de solveur de champ et confirmez avec votre fabricant PCB.":r?"Dies sind N\xe4herungswerte mit vereinfachten Microstrip-Formeln. F\xfcr Produktionsdesigns, verifizieren Sie mit Feldsolver-Simulation und best\xe4tigen Sie mit Ihrem PCB-Fertiger.":j?"これらは簡略化されたマイクロストリップ公式を使用した近似値です。製造設計では、フィールドソルバーシミュレーションで検証し、PCB製造業者に確認してください。":v?"Estos son valores aproximados usando f\xf3rmulas de microstrip simplificadas. Para dise\xf1os de producci\xf3n, verifique con simulaci\xf3n de solucionador de campo y confirme con su fabricante de PCB.":y?"Estes s\xe3o valores aproximados usando f\xf3rmulas de microstrip simplificadas. Para projetos de produ\xe7\xe3o, verifique com simula\xe7\xe3o de solucionador de campo e confirme com seu fabricante de PCB.":S?"Questi sono valori approssimativi utilizzando formule di microstrip semplificate. Per progetti di produzione, verificare con simulazione di risolutore di campo e confermare con il produttore di PCB.":k?"이것은 단순화된 마이크로스트립 공식을 사용한 근사값입니다. 생산 설계의 경우 필드 솔버 시뮬레이션으로 검증하고 PCB 제조업체와 확인하십시오.":D?"Это приближенные значения с использованием упрощенных формул микрополосковых линий. Для производственных проектов проверьте с помощью симуляции полевого решателя и подтвердите с вашим производителем печатных плат.":"These are approximate values using simplified microstrip formulas. For production designs, verify with field solver simulation and confirm with your PCB fabricator."})]})}),(0,i.jsx)("button",{onClick:()=>B(null),className:"w-full bg-indigo-600 text-white py-3 rounded-lg font-bold hover:bg-indigo-700 transition-colors",children:s?"关闭":n?"Fermer":r?"Schlie\xdfen":j?"閉じる":v?"Cerrar":y?"Fechar":S?"Chiudi":k?"닫기":D?"Закрыть":"Close"})]})]})})]})}}}]);